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LDS8711
We recommend C OUT in the range 1.0 – 2.2 μF to
achieve better efficiency and driver’s stability.
Recommended Layout
In active mode, the driver switches internally at a high
frequency. We recommend minimize trace length to
all external capacitors and inductor. The input and
output ceramic capacitors (X5R or X7R type) should
located as close to the device’ pins as possible to
prevent from EMI distribution
A ground plane should cover the area under the
driver IC as well as the bypass capacitors. Short
connection to ground on capacitors C IN and C OUT can
be implemented with the use of multiple via. A copper
area matching the TDFN exposed pad (PAD) must
be connected to the ground plane underneath. The
use of multiple via improves the package heat
dissipation.
Figure 4. Recommended layout
? 2010 IXYS Corp.
Characteristics subject to change without notice
9
Doc. No. 8711DS, Rev. N1.0
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